View FL3215T-101K_8362245.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

tdk corporation corporate headquarters 13-1,nihonbashi 1-chome,chuo-ku tokyo 103-8272 japan phone : tokyo(03)5201-7229 branch office sales div. phone ( ) product specification spec.no. c479naa00005_1 date 2009/3/24 digi-key c orporation customer's product name : tdk product name : fl3215t-000x this specification is : fully received denied received under the following condition signature : date: name(print) : title : circuit devices business group sales division prepared by approved by authorized by reviewed by authorized by h.itoh mar.24.'09 s.kikuchi mar.24.'09 m.takeda mar.24.'09
the products listed on this specification sheet are intended for use in general electronic equipment (av equipment, telecommunications equipment, home appliances,amusement equipment, computer equipment, personal equipment, office equipment, measurement equipment, industrial robots) under a normal operation and use condition. the products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to society, person or property.we are not responsible for any damage or liability caused by use of the products in any of the applications below or for any other use exceeding the range or conditions set forth in this specification sheet. aerospace/aviation equipment public information-processing equipment transportation equipment(cars, electric trains, ships,etc) military equipment medical equipment electric heating apparatus, burning equipment power-generation control equipment ? disaster prevention/crime prevention equipment atomic energy-related equipment ? safety equipment seabed equipment ? other applications that are not considered general-purpose transportation control equipment applications when using this product in general-purpose applications, you are kindly requested to take into consideration securing protection circuit/equipment or providing backup circuits, etc., the product should be used within 6 months of receipt, storage area must remain cool and dry, and free of corrosive fumes to ensure solder ability. add excessive bending stress to p.c.board, the products may open defect. so be careful to set up of mounter. comply with the specifications for rework on soldering after being mounted; excessive heating may result in short circuits, degradation, compromised reliability,etc. as the product temperature rises due to self-heating, the margin(of temperature rise) must be taken into account. as the magnetic field rises around the product due to current, take precautions in wrong action. take precautions in placement orientation of unshielded type inductors, for malfunction may occur due to magnetic interference, coupling. consult tdk for operating conditions of interlayer withstand voltage. do not use the product in a corrosive environment (gas, salt, acid, alkaline, etc). the product is not designed for radiation proof applications. to ensure higher safety. handling precautions tdk corporation when use the products, be careful to mentioned below for safety using. if make mistake in using ,be afraid of open,short,smoke. before use the products, must be read this specification. caution for safety using caution when handling
1. scope these specifications apply to the smd inductors fl3215 which digi-key corporation has requested delivery. 2. product name the products, which fall under these specifications, are given the name of customer tdk fl3215t-000x 3. product name description fl 32 15 t - ooo x 1234 56 1. product type 2. product length 3. product height 4. package type t(taping) 5. inductance value (name) 6. inductance tolerance k(+/-10%) m(+/-20%) 4. table of contents contents page 1. exterior, construction & dimensions. and the recommended land pattern,internal structure 2. electrical characteristics and measurin g j i g 3,4 3. ratings 5 4. others 5 5. tests 6 6. packaging specification 7,8 7. the recommended soldering condition 9 5.country of origin country of origin japan factory tdk shonai corporation tsuruoka, yamagata, japan revision drawing no. c479naa00005_1 2009/3/24 page 1 / 9 tdk corporation 2 tdk corporation magnetics business group division person issue date revision contents date revision
1. exterior, construction and dimensions 1.1. outline dimensions 1.2. the recommended land pattern 1.3. internal structure 1 core ferrite 2 winding material cu 3 terminal cu alloy sn plated 4 5 product specification c479naa00005_1 2 /9 tsb-08-01-05(00) page tdk corporation name of drawing drawing no. remark third angle projection unit scale size -mm - - - outer material glue no thermoplastic resin epoxy 1 2 1 parts q.ty materials terminal outer material winding material 2.0 1.2 1.2 2.0 glue core
2. electrical characteristics and the measuring jig 2.1. electrical characteristics srf [mhz] typ. r33m 0.33 20% 1.0 280 0.030 1500 2300 1r0m 1.0 20% 1.0 100 0.045 1200 2050 1r5m 1.5 20% 1.0 90 0.07 1600 2r2m 2.2 20% 1.0 70 0.08 1400 3r3m 3.3 20% 1.0 60 0.12 1100 4r7m 4.7 20% 1.0 50 0.15 1000 6r8m 6.8 20% 1.0 40 0.20 700 100k 10 1 0% 1.0 30 0.30 650 150k 15 1 0% 1.0 25 0.50 500 220k 22 1 0% 1.0 19 0.70 440 330k 33 1 0% 1.0 17 1.10 340 470k 47 1 0% 1.0 14 1.40 300 680k 68 1 0% 1.0 11 2.30 240 101k 100 1 0% 1.0 10 3.50 200 *idc1 : value obtained when dc current flows and the initial value of inductance has fallen by 10% product specification c479naa00005_1 3 /9 tsb-08-01-05(00) 140 *idc2 : self temperature rise 40degc. max. 340 270 210 180 1100 760 1000 800 640 520 400 page tdk corporation name of drawing drawing no. tdk item name fl3215t- test freq. [mhz] customer's p# l [uh] l tolerance [%] idc2 [ma] max. rdc [ohm] +/-20% idc1 [ma] max.
2.2 electrical characteristics measurement equipment?s inductance : agilent 4294a precision impedance analyzer rdc : adex ax-114n digital ohm meter s rf : agilent e5071b network analyzer 2.3. measuring jig 2.3.1. tdk tf-1 unit:mm dimension gap mm 2.4.examination conditions standard conditions is the temperature of 5 to 35 deg c, and 35 to 85% of humidity. when a doubt arises, it considers as the temperature of 20 +/- 2 deg c, and 65 +/- 5% of humidity. product specification c479naa00005_1 4 /9 tsb-08-01-05(00) page tdk corporation name of drawing drawing no. 3.0 50.8 25.4 6.2 6.5 6.5 gap 22.2 6.3 12.7 40.0 17.5 5.0 6. 5 11.0 19 6.3 5.7 4 3 12 17.8 13 6.5 6.5 c1 . 5 m3 base : plastic pbs 0.5t (ag or au plated)
3. ratings self temperature arising : less than 40 deg c storage temperature range : -40 deg c to +125 deg c operating temperature range : -40 deg c to +125 deg c (include self temperature rise) rating current : when the rating current flows, inductance should not drop more than 10 %. 4. others * should any doubts arise about this specification and others, it should be cleared by a conference between the customer and tdk. * product storage limit the storage limit of the products is 6 months with a temperature (20+/-10 deg.c) and a humidity (60+/-20%rh) whichever opened or not opened. the start of that should be the delivered date. about the product which has been left more than 6 months, please check the solderability and the peeling strength of the tape. then please judge whether it is ok or not. * please do not use the dropped product. product specification c479naa00005_1 5 /9 tsb-08-01-05(00) page tdk corporation name of drawing drawing no.
5. tests 5.1. reliability tests test name test method criteria 1 flexibility the sample shall be soldered onto the pcb as showen in figure 1 there should be and a load applied until the flexure in the arrow direction is made no abnormality. almost 10mm. then it should be returned to its original position. figure 2 figure 1 2 drop the sample shall be dropped once naturally onto a concrete floor delta l/l0 <= +/- 5 % from a height of 1.8 meter. there should be no mechanical damage. 3 vibration the sample shall be soldered onto the pcb, then the vibration having delta l/l0 <= +/- 5 % the frequency of 10 to 500hz/min. or the amplitude of 1.5mm there should be no should be applied. mechanical damage. 4 solderability fiux (rosin [jis-k-5902] ,isopropyl alcohol [jis-k-1522] and more than 90% of a solution [rosin 20+/-5wt%] ) shall be coated over the whole of the terminal should the sample beforehand, then it shall be preheated for about 2 minutes be coated with in 150 +0/-20 deg c. after that it shall be immersed for 3+1/-0 new solder seconds fully in pb-free solder [sn-ag3-cu0.5] with 245+/-5 deg c. 5 resistance fiux (rosin [jis-k-5902] ,isopropyl alcohol [jis-k-1522] and delta l/l0 <= +/- 5 % to soldering a solution [rosin 20+/-5wt%] ) shall be coated over the whole of there should be no heat the sample beforehand, then it shall be preheated for about 2 minutes mechanical damage. in 150 +0/-20 deg c. after that it shall be immersed for 10+1/-0 seconds fully in pb-free solder [sn-ag3-cu0.5] with 260+/-5 deg c. 6 temperature the test shall be performed after the sample has stabilized delta l/l0 <= +/- 10 % characteristics in -40 to +125 deg c, and the value calculated based on 20 deg c. 5.2. environmental tests the measurement shall be made after the sample has been left in a normal temperature and normal humidity for 1 or 2 hours. upon completion of those tests. test name test method criteria 1 heat shock the sample should be soldered onto the pcb, then it shall be delta l/l0 <= +/- 10 % left into 1000 cycles of temperature cycling for -40 deg c/ +125 deg c, there should be no 30 minutes each as one cycle. mechanical damage. 2 low temperature the sample shall be left for 1000 +/- 12 hours in an ambient delta l/l0 <= +/- 10 % storage temperature of -40+/-2 deg c. delta q/q0 <= +/- 30 % 3 high temperature the sample shall be left for 1000 +/- 12 hours in an ambient delta l/l0 <= +/- 10 % storage temperature of +125+/-2 deg c. delta q/q0 <= +/- 30 % 4 moisture storage the sample shall be left for 1000 +/- 12 hours in an ambient delta l/l0 <= +/- 10 % temperature of +60+/-2 deg c and a humidity of 90 to 95%rh. delta q/q0 <= +/- 30 % product specification c479naa00005_1 6 /9 tsb-08-01-05(00) page tdk corporation name of drawing drawing no. 90mm 10mm 20mm r340 10mm
6. packaging specification 6.1. dimensions of the emboss carrier tape [unit:mm] dimension * it shows the reference value without the tolerance. 6.2. dimensions of the reel. [unit:mm] dimension a 180 +0/-3 mm b 60 +1/-0 mm c 13 +/- 1.4 mm d 9.0 +/- 0.3 mm 6.3. terminal part and leader part tape 6.4. taping tests 6.4.1. peeling strength peeling strength : 0.098 to 0.686n (10 to 70gf) test conditions : the peel speed is 300 mm / minutes. : the peel angle is 165 to 180 degree toward the adhesive surface. 6.4.2 the minimum bend radius the minimum bend radius : 30mm there should be no droped or damaged one. product specification c479naa00005_1 7 /9 tsb-08-01-05(00) page tdk corporation name of drawing drawing no. 4.0+/-0.1 4.0+/-0.1 2.0+/-0.05 2.8 3.5 8.0+/-0.3 3.5+/-0.05 1.75+/-0.1 a0 b0 k 1.65 p0 p1 p2 wf e blank components blank leader 40mm min. 210mm min. 200mm min. (0.4) a 13+/-0.2 b 2+/-0.5 d 21+/-0.8 c
6.5. the quantity and form 2000 pieces / reel should be the standard. there should be no lack. there should be no joint in the carrier tape. 6.6. lot. no. tu 9324 xxxx 1234 5 1 factory code tu : tdk shonai corporation 2 inspection year the bottom of a.d. 3 inspection month october : x, november : y, december : z 4 inspection date 5 factory management code 6.7. display (display the following below every packing unit) 1. customer's product name (if requested) 2. tdk product name * the label position on the reel 3. tdk item code 4. inspection number 5. quantity 6.8. packaging outer box reel number dimension a dimension b dimension c type a 2 reel max. 185 mm 195 mm 35 mm type b 4 reel max. 185 mm 195 mm 60 mm type c 5 reel max. 185 mm 195 mm 80 mm type d 10 reel max. 185 mm 195 mm 155 mm product specification c479naa00005_1 8 /9 tsb-08-01-05(00) page tdk corporation name of drawing drawing no. sticked on the left side of the outer box. d type sticked on the top side of the outer box. a type b type c type the manufacture label the shipping label
7. recommended soldering conditions 7.1. reflow soldering conditions item conditions pre-heat temp. 150 to 180 deg c. zone time 90 to 120 sec. heating temp. 230 deg c. zone time 40 sec. max. peak temp. 260 deg c. max. temperature time 10 sec. max. number of times 2 max. 7.2. flow soldering conditions item conditions pre-heat temp. 150 to 170 deg c. zone time 60 to 120 sec. heating temp. 260 deg c. max. zone time 10 sec. max. number of times 2 max. 7.3. iron soldering condition iron tip temperature : 300 to 350 deg c heating time : 3 seconds / time iron conditions : around 30w, tip diameter is around 1mm. on these conditions, the product temperature must be less than 260 deg c. and the total heat treatment time must be less than 10 sec. * about washing conditions solvent : except for the strong acid or alkaline solvent is recommended. method : soaking or showering is recommended. time : less than 2 minutes is recommended. product specification c479naa00005_1 9 /9 tsb-08-01-05(00) page tdk corporation name of drawing drawing no. pre-heat heating peak pre-heat heating

▲Up To Search▲

Price & Availability of FL3215T-101K

	To Download FL3215T-101K Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .